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  • t 18, 2005Lam Research CorporationMethod of and platen for controlling removal rate characteristics in chemical mechanical planarizationUS6958001Dec 13, 2004Oct 25, 2005Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpiecesUS6962524Aug 15, 2003Nov 8, 2005Applied Materials, Inc.Conductive polishing article
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