It will be understood that the leadframe strip 22 is fabricated from a copper panel substrate that has been subjected to a selective wet etch process to provide the leadframe strip 22 shown in FIG. 1A. The leadframe strip 22 is then plated with a suitable metal or metals such as silver (Ag), nickel and gold (Ni/Au), nickel and palladium (Ni/Pd) or nickel, palladium and gold (Ni/Pd/Au), to facilita