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  • FIGS. 6A to 9 are diagrams illustrating a method of fabricating an ultrathin module in accordance with the present invention, wherein FIGS. 6A and 6B are a plan view and a cross-sectional view, respectively, of a wafer including semiconductor device chips, FIGS. 7A and 7B are a plan view and a cross-sectional view, respectively, of the wafer and show chip covers directly attached to the semiconduc
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