A thermally conductive material such as copper or aluminum, for example, can be deposited or applied to the upper surface 28 (2) of the die 12 a (2), 12 b (2) within the confines of the standoff(s) 16 (2) to form a heat sink 31 (2) for dissipating heat from the die 12 a (2), 12 b (2) during operation. [0053] In another embodiment, a heat sink material 31 (3) can be disposed about the standoff(s) 1