tional solder and articles made therewith, such as microelectronic componentsUS7347348 *Dec 14, 2004Mar 25, 2008Micron Technology, Inc.Apparatus and method for depositing and reflowing solder paste on a microelectronic workpieceUS7365424May 18, 2006Apr 29, 2008Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making sameUS7368810Aug 29, 2003May 6,