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  • Other substrates suitable for use in the biomedical, computer, telecommunications, defense, aerospace and other industries may also be used. [0054] A metalization layer 14 having a metal pattern 30 may be formed on top of the base substrate 12 as shown in FIG. 3B. The metalization layer 14 and metal pattern 30 may be formed with standard resist and photolithography techniques or may be formed usin
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