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  • tleUS5514627 *Jan 24, 1994May 7, 1996Hewlett-Packard CompanyIncreasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperatureUS5726216 *Jul 8, 1996Mar 10, 1998Lockheed Martin Energy Systems, Inc.Toughened epoxy resin system and a method thereofUS5869167 *Sep 20, 1996Feb 9, 1999Canon Kabushiki KaishaPolymer resin film on paper base, backing covering port
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