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  • semiconductor device assemblies, packages including the same, and methodsUS7915077Jul 28, 2008Mar 29, 2011Micron Technology, Inc.Methods of making metal core foldover package structuresUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7994547Jul 23, 2008Aug 9, 2011Micron Technology, Inc.Semiconductor devices and assemblies incl
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