y, Inc.Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processesUS714754328 juil. 200512 d???c. 2006Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpiecesUS722329728 juin 200529 mai 2007Micron Technol