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  • FIG. 15A is a cross-sectional view illustrating a fifth embodiment of the bump leaded film carrier type semiconductor device according to the present invention, and FIG. 15B is a bottom view of the device of FIG. 15A. Note that FIG. 15A is a cross-sectional view taken along the line A--A of FIG. 15B. The fifth embodiment is similar to the fourth embodiment.
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