Alternatively, the seed layer 2524 b, such as copper, can be sputtered, electroless plated or electroplated on the adhesion/barrier layer 2524 a formed by first sputtering a chromium layer and then sputtering a chromium-copper-alloy layer on the chromium, and then the bulk metal layer 254 is electroplated or electroless plated on the seed layer 2524 b.