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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • To electrically link the electronic package 1 to another component such as a printed circuit board (not represented), the rear face 4 of the substrate wafer 2 may be provided with metallic electrical connection elements 32, such as balls, placed on rear bump contacts of the electrical connection network 5.
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