The thermal contact pad can be fabricated using material having high heat conductivity such as gold, silver, tin, or other material including but not limited to precious metals. [0071]FIG. 7C illustrates a cut-away front view of portions of the substrate 20 b taken along section line A-A of FIG. 7A. As shown in FIG. 7C, one or more via holes 45 a, 45 b may be formed through the substrate 20 b.