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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • These materials are useful in a number of thermoset applications including, for example, adhesives, encapsulation, structural laminates, potting and casting compounds, extrudable thermosetting resins, printed circuit boards, and other applications in which low dielectric constant, dissipation factor, and/or good thermal properties are required.
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