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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • The solder balls 20, which may include materials such as tin lead or any lead free metal alloy or other suitable material, preferably SnAgCu in one example embodiment, are attached to the lower surface 4 of the substrate 2 by means of a plurality of ball pads 15.
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