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  • Note that in some embodiments, a material such as a conductor or insulator may be deposited or formed over the top surface of the gate material, before or after patterning the features 250 a and 250 b, so that the top surface of the gate material is not implanted with the dopant species (not shown in the drawings) during the novel implantation processes 222, 224, 226, and 228.
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