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  • Applied Materials, Inc.In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarizationUS686079125 Nov 20031 Mar 2005Applied Materials, Inc.Polishing pad for in-situ endpoint detectionUS68607988 Aug 20021 Mar 2005Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods fo
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