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  • pida Memory, Inc.Multilayer semiconductor deviceUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7910838Apr 3, 2008Mar 22, 2011Advanced Interconnections Corp.Solder ball interfaceUS7915718 *May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging p
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