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  • 48 *Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS8013437Sep 4, 2007Sep 6, 2011Utac Thai LimitedPackage with heat transferUS8067827May 21, 2007Nov 29, 2011Micron Technology, Inc.Stacked microelectronic device assembliesUS8169058 *Aug 21, 2009May 1, 2012Stats Chippac, Ltd.Semico
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