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  • 1Opportunities and Challenges for use of Nanotechnology in Microelectronic PackagingNachiket Raravikar, Nirupama Chakrapani, Lakshmi Supriya and Vijay Wakharkar, Assembly and Test Technology Development, Technology Manufacturing Group, Intel Corporation, Chandler, Arizona Rapid evolution of complex packaging architectures is ongoing, especially with the convergence of computing and communication I
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