paratus to change solder pad size using a differential pad platingUS79026486 Abr 20068 Mar 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7906733 *21 May 200815 Mar 2011Canon Kabushiki KaishaElectronic circuit deviceUS791571817 May 200229 Mar 2011Micron Technology, Inc.Apparatus for flip-chip pac