A metal film is deposited on the resist layer 28, in the resist opening 30 and in the window 32 by, for example, an evaporation process in which a metal such as titanium (Ti), nickel (Ni), palladium (Pd), platinum (Pt), molybdenum (Mo), tungsten (W), gold (Au) or a combination thereof is heated to the point of vaporization and then evaporated to form the metal film.