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  • FIG. 11 illustrates an eighth embodiment hereof; FIG. 11A is a plan view showing a semiconductor chip 31h constituting the power control device and FIG. 11B is a sectional view thereof taken on line 11B--11B in FIG. 11A. In the semiconductor chip 31h, a cathode 45h comprises an upper and lower layers wherein the upper layer defines a pad portion 43h and the lower layer defines a contact portion 48
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