FIG. 6A is a cross-sectional view that shows the placement of features that appear in one or both of the embodiments of FIGS. 6 or 6B. The susceptor 40 of the embodiment of FIG. 6 utilizes electrostatic wafer clamping, an electrically insulating wafer supporting surface, an insulating ring around the outer edge of the wafer support surface, RTDs for temperature sensing in the wafer support, an ine