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  • ining layers including a metal bonded to halogens and trialkylaluminumUS6955211Jul 17, 2002Oct 18, 2005Applied Materials, Inc.Method and apparatus for gas temperature control in a semiconductor processing systemUS6958296Jul 22, 2003Oct 25, 2005Applied Materials, Inc.CVD TiSiN barrier for copper integrationUS6958300Aug 28, 2002Oct 25, 2005Micron Technology, Inc.Systems and methods for forming metal
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