Once the image 50 in FIG. 19E is formed, the masking material such as chrome, tungsten, gold etc. may be deposited into the openings or etched away, as required for the masking level with images 41 in FIG. 19A. This image is modified, compared to image 49 in the prior art illustrated in FIG. 19B. The critical would be design rule violations in placement of shapes 49 in FIG. 19B were corrected as c