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  • n Technology, Inc.Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpiecesUS7134933Feb 15, 2005Nov 14, 2006International Business Machines CorporationWafer thickness control during backside grindUS7147543Jul 28, 2005Dec 12, 2006Micron Technology, Inc.Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro
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