In the drawing, reference numeral 1Arepresents a wafer; 1B is an area which is to serve as one chip upon dicing; and 10 is a dicing area in order to divide the wafer 1A into a plurality of chips 1B. The semiconductor region 7B is formed as one continuous region along the side of the chip1B outside the input terminal BP.According to the arrangement described above, the semiconductor region 7B can h