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  • .Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7948093 *Dec 27, 2007May 24, 2011Samgsung Electronics Co., Ltd.Memory IC package assembly having stair step metal layer and aperturesUS7971481Sep 30, 2008Jul
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