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  • S???(2W)2 (In the formula, S is an area of the planar projection, and W is a line width of the circuit line adjoining to the planar projection.) The present invention also provides the IC tag as described above, wherein the release agent layer is formed to cover the range of 20 to 90 percents of an area surrounded by an outside circumference of the circuit section through the first adhesive layer.
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