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  • 23, 2003International Rectifier CorporationChip scale surface mounted device and process of manufactureUS6677669Jan 18, 2002Jan 13, 2004International Rectifier CorporationSemiconductor package including two semiconductor die disposed within a common clipUS6680241Dec 14, 2000Jan 20, 2004Fujitsu LimitedMethod of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor
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