About: isa:265785640   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • In consequence, either for use in fabrication of multilayer printed circuit boards or for use in film overlay, a demand has grown for adhesives which can be used in heat contact bonding at a low temperature of 250 ??? C. or less and yet perform well in such properties as adhesive strength, chemical resistance, heat resistance, heat resistance at soldering temperature after moisture absorption and
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software