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  • In a second embodiment, the lead frame is a composite...http://www.google.com/patents/US6323543?utm_source=gb-gplus-sharePatent US6323543 - Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationAdvanced Patent SearchPublication numberUS6323543 B1Publication typeGrantApplication numberUS 09/548,147Publication dateNov 27, 2001Filing dateApr 13, 2000Priorit
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