prov:value
| - In the context of the present invention, technical materials which may be mentionedare preferably adhesives, sizes, papers and boards, leather, wood, coatings, cooling lubricants and heat transfer fluids, particularly preferably coatings.Microorganisms which can break down or change the technical materials and which may be mentioned by way of example are bacteria, fungi, yeasts, algae and slime-fo
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