About: isa:266142461   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • n resistance of stacked dies in die sawUS8816494 *Jul 12, 2012Aug 26, 2014Micron Technology, Inc.Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packagesUS8922026Jul 19, 2012Dec 30, 2014Chien-Hung LiuChip package and fabrication method thereofUS8940581Nov 16, 2011Jan 27, 2015Micron Technology, Inc.Packaged microelectronic de
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software