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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
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  • nc.Lead end grid array semiconductor packageUS586695324 May 19962 Feb 1999Micron Technology, Inc.Packaged die on PCB with heat sink encapsulantUS587996519 Jun 19979 Mar 1999Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS588342618 Abr 199716 Mar 1999Nec CorporationStack moduleUS589175324 Ene 19976 Abr 1999Micron Technology,
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