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  • n 24, 2008Jan 11, 2011Epic Technologies, Inc.Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layerUS7902648Apr 6, 2006Mar 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for
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