On the other hand, passive devices such as capacitors, resistors and coils are created on an insulating film on the surface of the substrate from aluminum layers AL1, AL2 and AL3 and a poly-silicon layer P???Si in many cases as shown in FIGS. 5C, 5D and 5E. In the substrate area beneath the passive devices, that is, in the monolithic-crystal silicon layer 203 of the embodiment shown in FIG. 3, no