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  • nding to a primary bonding padUS55236974 Mar 19944 Jun 1996Micron Technology, Inc.Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereofUS553516530 Jun 19959 Jul 1996Cirrus Logic, Inc.Circuits, systems and methods for testing integrated circuit devices including logic and memory circuitryUS559469428
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