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  • ngbi JiangPlastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS20020043398Sep 17, 2001Apr 18, 2002Takeo NakagawaConductive plastic, conductive circuits formed thereof, and method of forming the conductive circuitsUS20030179551Mar 18, 2003Sep 25, 2003Shinichi SugimotoCircuit board connection structure, method for forming the same, and display device ha
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