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  • n Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718 *May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7960269Jul 24, 2006Jun 14, 2011Megica CorporationMethod for forming a double embossing structureUS7973629Oct 31, 2007Jul 5, 2011Megica Corp
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