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An Entity of Type : prov:Entity, within Data Space : webisadb.webdatacommons.org associated with source dataset(s)

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  • n PCB with heat sink encapsulantUS587996519 Jun 19979 Mar 1999Micron Technology, Inc.Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationUS588342618 Abr 199716 Mar 1999Nec CorporationStack moduleUS589175324 Ene 19976 Abr 1999Micron Technology, Inc.Method and apparatus for packaging flip chip bare die on printed circuit boardsUS589179720 Oct 19976 Abr 1
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