n a sputtering chamber 250 which includes a chamber 252, a nickel (Ni) target 254, a wafer substrate 256 facing the target 254 in a spaced relationship, an outlet 258 to a pump (not shown) for drawing a vacuum on the chamber 252, an inlet 260 or an ion beam gun 264 for receiving a working gas, such as argon (Ar), and a reactive gas, such as oxygen (O2) and a first ion beam gun 262 for receiving a