In the present invention, in the case where a support substrate 2 is to be formed of a metal such as ruthenium (Ru), rhodium (Rh), palladium (Pd), iridium (Ir), gold (Au), silver (Ag), copper (Cu), nickel (Ni) or the like or an alloy containing at least one of these metals as a principal component, the support substrate 2 can be formed in a similar manner to that of fabricating the support substra