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  • In a conventional a semiconductor-device mounting process, a single semiconductor chip is disposed on one face of a die pad of a lead frame made of a material such as a 42-alloy, Cu or the like, the bonding pads of the semiconductor chip and the inner leads of the lead frame are wire-bonded to each other through metallic fine wires made of Au, Al, Cu or the like, and the semiconductor chip, the bo
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