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  • ing cover elements positioned over the contact pads thereof; FIG. 2B is a side cross-sectional view of the array shown in FIG. 2A, including encapsulating material disposed about the semiconductor dice to form an assembly; FIG. 2C is a side cross-sectional view of the assembly shown in FIG. 2B, but without cover elements; FIG. 3A is a side cross-sectional view of an array of semiconductor dice inc
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