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  • The dual damascene structure is then filled with a suitable conductive material such as aluminum or copper and planarized using chemical mechanical polishing. [0009] U.S. Pat. No. 6,281,127 B1 entitled ???Self-Passivation Procedure For A Copper Damascene Structure??? granted Aug. 28, 2001 to Shue shows a barrier cap over a copper dual damascene interconnect.
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