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  • r 2011Micron Technology, Inc.Methods for forming through wafer interconnects and structures resulting therefromUS79026486 Abr 20068 Mar 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS79110375 Ago 200922 Mar 2011Amkor Technology, Inc.Method and structure for creating embedded metal featuresUS79157
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