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  • r 8, 2011Micron Technology, Inc.Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsUS7915718 *May 17, 2002Mar 29, 2011Micron Technology, Inc.Apparatus for flip-chip packaging providing testing capabilityUS7948077Jun 6, 2008May 24, 2011International Business Machines CorporationIntegrated circuit chip module with microchannel coo
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