prov:value
| - Preferably, the method of the present invention is used to enhance the bondability of a polymeric body comprising silicone to a second polymeric body comprising one or more polymers, e.g., silicone, polyester, polyether/polyester block copolymers, nylon polymers, polyether/amide block copolymers, polyamides, polyimides, polyurethanes, hydrocarbon polymers such as polyethylene and polypropylene, sy
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